What is the Indium Bonding for Sputtering Target?

The term “indium bonding” in thin film coating industry, simply speaking, refers to bond two (or more) sputtering targets with indium (In), or one (or more) with indium plate together.


Indium can be uniquely used in lower temperature solders, is one of the softest materials. Indium is preferred for target bonding because of its excellent thermal conductivity of all available bonds. In addition, indium is the most efficient material at drawing heat away from the sputtering target. Most materials can be indium bonded and there are just a few exceptions.

Apart from indium bonding, indium is also popular for a variety of uses and purposes, such as creating alloys, photoconductors, and thermistors.

Indium bond

Sputtering target can be cracked, warped or damaged due to inadequate cooling, low hardness or other reasons. From this point of view, although target bonding does generate a fee, it can well protect your target from damage. It is especially true for those less-strong target materials and precious metal materials.

Elastomer is an alternative bonding method that touts a higher temperature capability over the indium bond. Elastomer bonds are recommended when you are consistently melting indium bonds. We also recommend elastomer bonding for low melting point target materials, as well as, temperature sensitive compounds and targets that have either low density or are especially fragile.

indium target bonding

Indium bonding is preferred in applications where:

Cryogenic stability is needed

Sealing requires high levels of hermeticity

Maximum thermal transfer is required

Bonding to not-metallic surfaces

Flux cannot be used

Backing plates

OFHC Copper Backing Plate is another well-known backing plate. It is frequently used to bond ceramic targets because of its non-magnetism and low coefficient of thermal expansion. This metal has good electrical and thermal characteristics while also being easy to machine, easy to soften, and readily available at a low cost. Copper backing plates can be re-used, with care, 20 or more times.

Molybdenum plate is usually used to substitute copper plate if copper is not appropriate in the application. For instance, the coefficient of expansion for copper is mismatched with some ceramics. And for high-temperature bonding, copper may also oxidize badly or warp. In these conditions, molybdenum is a more suitable material.

SAM Sputter Target

If you are looking for an indium bonding manufacturer, SAM is undoubtedly your best choice. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please see our listing of frequently asked questions (FAQs).

Related blog: When do you need target bonding?

Requirements of ITO sputtering targets for LCDs

After a long period of development, the quality of liquid crystal displays (LCDs) continues to increase, and the cost continues to decline. This means that LCDs have higher requirements for ITO sputtering targets. Therefore, in order to keep up with the development of LCD, the future development trend of ITO targets is as follows:

Liquid crystal displays
Liquid crystal displays
Lower resistivity

In recent years, liquid crystal displays have been moving in a more and more refined direction, and with the upgrade of drivers, a transparent conductive film with lower resistivity is required. Therefore, the resistivity of their raw material—ITO target—is also required to be lowered.

Increase target density

When the target density is low, the surface area for effective sputtering is reduced, and the sputtering speed is also lowered. The high-density target has uniform surface, and can obtain low-resistance film. In addition, the density of the target is also related to its service life, and the high density target generally has a longer life. This means that increasing the density of the target not only improves the film quality, but also reduces the cost of the coating, so it must be the direction for the future development of ITO targets.

Larger size

Now that the LCD screen is getting bigger and bigger, correspondingly, the size of the ITO target has to be larger. However, there are still many problems to be solved in large area coating. In the past, people weld small targets together and splice them to achieve large area coating. But the joints were likely to cause a drop in coating quality. In order to solve this problem, the size of ITO sputtering target is required to be larger in the future. This is also a big challenge for the ITO target industry.

Higher use ratio

Planar targets are still one of the most used types of sputtering targets. But one of the deadliest disadvantage of planar targets is the low use ratio. People may develop other types of ITO target, such as rotatory targets and cylindrical planar targets in the future to increase target utilization.

Please visit https://www.sputtertargets.net/ for more information.

A short analysis of sputtering targets for semiconductor application

Semiconductors have high requirements for the quality and purity of the sputtering materials, which explains why the price of anelva  targets is relatively high.

Undoubtedly, sputtering targets are the most important raw materials in current semiconductor manufacturing processes. Their quality and purity play a key role in the subsequent production quality of the semiconductor industry chain. And anelva targets refer to those sputtering targets used in the semiconductor industry.

Application requirements

Semiconductors have high requirements for the quality and purity of the sputtering materials, which explains why the price of anelva  targets is relatively high. In the semiconductor manufacturing process, if the impurity content of the sputtering target is too high, the formed film cannot achieve the required electrical properties, and it is liable to cause short circuit or damage of the circuit, which will seriously affect the performance of the film.

Therefore, when purchasing semiconductor targets, be sure to find a reliable sputtering targets manufacturers for high-quality & high-purity sputtering targets.

blue computer circuit board closeup , semiconductor industry

Market Size

With the rapid development of terminal applications such as consumer electronics, the market sales of high-purity sputtering targets are expanding.

According to statistics, in 2015, the global high-purity sputtering target market sales reached 9.48 billion US dollars, of which, the semiconductor sputtering target market sales of 1.14 billion US dollars. It is estimated that in the next five years, the market size of the world’s sputtering targets will exceed 16 billion US dollars, and the CAGR (Compound Annual Growth rate) of the high-purity sputtering target market will reach 13%.

According to statistics from WSTS (World Semiconductor Trade Statistics), the global target market is expected to grow at the same rate as 2017 (13%). In 2016, the global sputtering target market capacity was US$11.36 billion, an increase of 20% compared to US$9.48 billion in 2015. It can be inferred that the market size of the global high-purity sputtering target in 2018 is about 14.5 billion US dollars.

Stanford Advanced Materials (SAM) Corporation is a global supplier of sputtering targets such as metals, alloys, oxides and ceramic materials, which are widely used in multiple industries. Please visit https://www.sputtertargets.net/ for more information.

What is Target Poisoning in Sputtering Deposition?

At some stage in the sputtering deposition, positive ions are continuously amassed on the surface of the sputtering target. Due to the fact that those fantastic ions aren’t neutralized, the negative bias of the target surface gradually decreases, and progressively the normal operation can not be completed. This is the target poisoning phenomenon.

The word “poisoning” is normally used to describe the poisoning as a result of the consumption of positive toxic substances via dwelling organisms. However, have you ever heard of target poisoning? Do you already know what it is?


Despite the fact that the same word is used for “poisoning”, the meaning of target poisoning and human poisoning is completely different. At some stage in the sputtering deposition, positive ions are continuously amassed on the surface of the sputtering target. Due to the fact that those fantastic ions aren’t neutralized, the negative bias of the target surface gradually decreases, and progressively the normal operation can not be completed. This is the target poisoning phenomenon.

target poisoning
target poisoning


Target poisoning does not always occur. It is associated with various reasons, of which the following factors are the most significant:

1 There is air leak or water leakage occurs in the vacuum chamber; There are volatile components in the vacuum chamber; The vacuum chamber is not filled with argon, but mixed with air or other gases.

2 The impurity component reacts with the sputtering material to form certain substances, which cover the surface of the sputtering target and affect the film formation speed.

3 There is a change in secondary electron emission, which results in a change of the discharge impedance. Consequently, at the same discharge power, the current and voltage can change substantially as reactive gas is introduced.


Luckily, as I mentioned before, the poisoning the the target surface does not always occur, and it can be prevented by the following methods:

1 Ensure that the vacuum chamber is not leaking; Clean the inside of the vacuum chamber regularly to remove volatile components.

2 Irradiate the sputtering target with a medium source or Radio Frequancy (RF) source for one to two hours.

3 If target poisoning occurs, the sputtering target should be removed and be polished with sandpaper.

Please visit https://www.sputtertargets.net/ for more information.

What should we do when the target is broken?

For most of the time, people consider the purity, and maybe the shape, of the sputtering target when they are purchasing the target materials. But one thing should not be ignored is the target bonding. Well, you think it unnecessary and costly? Then just think about what to do when your target is broken.broken target

Target bonding is necessary

Maybe you can use a copper plate to stick the broken pieces of the target and then polish the target so that the broken areas have minimum exposure to plasma. The second step is very important because the power would suddenly breakdown to zero when plasma strike to broken area of target. And obviously, the film quality will be affected if breakdown is frequent. Although it may help solve the problem when the target is broken, it is still a remedial measure. To avoid target from breaking, you need to give a target bonding service to the target. It is necessary for those brittle targets, and is not expensive compared with the losses of the broken target.

Continue reading “What should we do when the target is broken?”

What is Magnesium Fluoride?

Chemical Formula of Magnesium Fluoride
Chemical Formula of Magnesium Fluoride

SAM®Magnesium fluoride is an inorganic compound with the formula MgF2, which is a white, fluorescent crystal. It is insoluble in water and alcohol, and soluble in nitric acid. It can be used in ceramics and glass. Magnesium Fluoride is one of the lowest index infrared materials that it is transparent over a wide range of wavelengths, thus is used for optical elements in both the infrared and ultraviolet. It is resistant to thermal and mechanical shock and is twice as hard as Calcium Fluoride.

Continue reading “What is Magnesium Fluoride?”

How is tantalum used in phones?

We have talked about the Application of Tantalum Target in Thermal Inkjet Print Head and Copper Plating before, which rises your interest on this element. However, most people think thermal inkjet print and copper plating are far away from their life, thus are difficult to understand. So today, SAM sputter targets will talk about something that EVERYONE is familiar with—your mobile phones.


Tantalum is a very important element in the electronic industry. And it is widely used in all kinds of electronic devices, such as phones and computers. The main use of tantalum materials in electronic products comes in the creation of tantalum capacitor. Tantalum capacitors have their unique advantages over other capacitors. They do not use electrolytes like ordinary electrolytic capacitors, making them ideal for operation at high temperatures. Solid tantalum capacitors have excellent electronic properties, wide operating temperature range, various forms and excellent volumetric efficiency.

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What is Copper Sulfide Sputtering target?

Copper sulfide is an inorganic compound with a chemical formula of CuS. It is dark brown and extremely insoluble. It is one of the most insoluble substances (second only to silver sulfide, mercury sulphide, palladium sulfide and platinous sulfide).

 Copper Sulfide Sputtering target
Copper Sulfide Sputtering target

Copper sulfide sputtering targets can be used in the semiconductor industry for the fabrication of thin film deposition from different materials for processing of integrated circuits, fabrication of architectural window glass used for energy conversation, data storage, hybrid or microelectronics, photonics  and fabrication of CDS as well as DVDs. Copper sulfide sputtering targets have different and new-fangled dimensions and product geometries.

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What is ITO (indium tin oxide) Sputtering Target?

As its name suggests, ITO sputtering target mainly contains three elements of indium, tin and oxygen. More specifically, ITO sputtering target is a black-gray ceramic semiconductor (as shown below) formed by a series of production processes after indium oxide and tin oxide powder are mixed in a certain ratio, and then sintered in a high temperature atmosphere (1600 degrees, oxygen sintering).


As one of the most widely used transparent conducting oxides, Indium tin oxide (ITO) has good electrical conductivity and optical transparency. The transmittance and resistance of ITO are controlled by the ratio of In2O3 to SnO2, respectively, and the performance is usually best when SnO2:In2O3=1:9. The most common method for preparing ITO films is physical vapor deposition (PVD). To know more information about PVD technology, please read this article What are the uses of PVD (Physical Vapor Deposition) coating. And, to know more about how to produce ITO target, please read another article Four main molding methods for ITO (Indium Tin Oxide) targets.

Continue reading “What is ITO (indium tin oxide) Sputtering Target?”

Manufacturing process of semiconductor wafer

Semiconductor wafers are the basic material for manufacturing chips. The most important raw material for semiconductor integrated circuits is silicon, which is widely found in rocks and gravel in the form of silicate or silicon dioxide in nature. The manufacturing process of semiconductor wafers/silicon wafers can be divided into three basic steps: silicon purification, monocrystalline silicon growth, and wafer formation.

Silicon purification

The sandstone material is placed in a 2000 °C electric arc furnace which has a carbon source. At high temperatures, the silica in the carbon and in the sandstone undergoes a chemical reaction (carbon is combined with oxygen, leaving silicon) to obtain pure silicon having a purity of about 98%, also known as metallurgical grade silicon. Continue reading “Manufacturing process of semiconductor wafer”