Sputtering is a high-speed process where superfast ions hit a sputtering target and dislodge minuscule particles that in turn coat a thin film on substrates like architectural glass, LED televisions and computer displays.
Rotatable sputtering target, or rotatory target, is a commonly used target shape in magnetron sputtering. It is generally cylindrical, with a stationary magnet inside, and a slow magnetic field, which allows the sputtering rate to be uniform and the target utilization rate to be high. Rotating targets are commonly used for coating solar cells, architectural glass, automotive glass, semiconductors, and flat-panel TVs.
The main advantage of the rotatable target is the high utilization of the target, which means that the rotating target can solve the problem of low utilization of the planar target.
For a planar sputtering target, the target utilization of the normal cathode can reach 25%, and the special design of the magnet bypass with the target back can increase the target utilization to about 40%. Despite this, the utilization of planar targets is still not high. However, the utilization of cylindrical rotating targets is typically in the range of 75% to 90%, much higher than planar targets. However, when the rotating target is used for large-area coating, the uniformity of the surface of the film layer is poor and it is difficult to meet the requirements, which is the biggest disadvantage of the rotating target.
| Materials | Planar | Rotatory |
| Metal | Planar molybdenum target, planar copper target, planar titanium target, planar tungsten target, planar zirconia target
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Rotatory molybdenum target, rotatory copper target, rotatory titanium target, rotatory tungsten target, rotatory zirconia target
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| Oxides | Planar SiO2 Sputtering Target | Rotatory ATO Sputtering Target, rotary Nb2Ox sputtering target, rotatory TiOx sputtering target, rotatory Al2O3 sputtering target |
| Alloy | Planar Cr-Ta sputtering target, planar Ti-Al-Si sputtering target | SnO2-Sb2O3 rotatory sputtering target |
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