Titanium Nitride Sputtering Target and Applications

Titanium nitride, a chemical formula of TiN, is an extremely hard ceramic material. Titanium nitride sputtering is commonly used as a coating on titanium alloys, steels, carbides and aluminum components to improve the surface properties of the substrate.

As a thin coating, titanium nitride (TiN) sputtering targets can be used to harden and protect cutting and sliding surfaces, also for decorative purposes (due to its golden appearance), and as a non-toxic medical implant Implanted into the human body. In most applications, the thickness of the TiN coating is less than 5 microns (0.00020 inches).

Material Type Titanium Nitride
Symbol TiN
Color/Appearance Yellow-Brown, Crystalline Solid
Melting Point (°C) 2,930
Theoretical Density (g/cc) 5.4
Z Ratio **1.00
Sputter RF, RF-R
Max Power Density
(Watts/Square Inch)
Type of Bond Indium, Elastomer
Comments Sputtering preferred. Decomposes with thermal evaporation.

The titanium sputtering target itself has excellent properties such as high corrosion resistance, high mechanical properties, high thermal properties, etc., and is therefore used in many industrial and medical applications. Titanium nitride also has its unique advantages such as wear resistant coatings, tools for cutting, diffusion barriers and integrated circuits. Titanium nitride also has outstanding physical properties such as high hardness, inert, high corrosion resistance, low electrical resistivity, excellent thermal stability. These titanium and titanium nitride coating materials have the combination of toughness, inertness, adhesion and hardness, owing to its excellent Thus, titanium and titanium nitride coatings have various advantages over other coating materials, including microelectronics, photodetectors, cutting tools, and medical instruments. Therefore, there has been a particular interest in these Ti and TiN coatings over the years.titanium-nitride-coating

When we look at sputtering targets, we can say that titanium nitride is one of the important compounds prepared by sputter deposition, and these nitride films are used in a wide range of applications. The titanium nitride deposition is prepared by using nitrogen as a reaction gas and argon as a sputtering gas, and the composition of the film can be controlled by using different sputtering gas ratios (Ar / N2 ).

For more information about sputter materials, please visit our website https://www.sputtertargets.net/.

Planar Sputtering Target: Pros and Cons

Although the rotary targets have developed in recent years, the mainstream shape of the sputtering target is still the planar type. Today let us take a look at the pros and cons of planar targets to help you determine whether a planar sputtering target is suitable for your project.

Advantages of Planar Sputter Target

Simple structure – one of the main advantages of the planar target is that the structure is simple. The common planar targets on the market are rectangular planar targets and circular planar targets, which are easily produced by molds. In other words, planar target preparation requires fewer machines and technologies and is easier to prepare. This is why planar targets still dominate the sputtering target market.

Planar sputtering target mould

Low price – You can never deny that the price is always an important competitive factor. As mentioned above, the manufacturing process of the planar sputter target is easier, so its price is much lower than the rotatory sputter target.

Strong versatility – Planar sputtering targets usually have strong versatility. Therefore, the transportation of the planar targets is relatively simple and is not easily damaged during transportation.

Good uniformity and repeatability – Film layers sputtered by planar targets usually boast good uniformity and repeatability. Planar targets are still best suited for prototype work or elemental experimentation, especially when large amounts of material are not needed at once.

Disadvantages of Planar Sputter Target

Its biggest disadvantage is the low utilization rate (generally only about 20%).  In the sputtering process of the planar target,  a strip-shaped pit will be formed when the target of the glow region (the magnetic field distribution region) is consumed to a certain extent, making the target body thinner. And once the pit depth reaches a certain value, the target cannot be utilized anymore. The low utilization rate also reduces its price advantage to some extent.

In conclusion, planar targets are still the best choice for prototype work or elemental experimentation, especially when large amounts of material are not needed at once. But its disadvantage of low utilization rate (20% vs. 80% compared with the rotatory target) does constrain its development.

Next week, let us look at the biggest competitor of the planar target– the rotatory target. Weighting the pros and cons of these two types of sputtering target may help you better choose the one for your application.

Please visit https://www.sputtertargets.net/ for more information.

Two Methods for Preparing NiCrSi High Resistance Sputtering Target

NiCrSi high-resistance sputtering targets are mainly used to prepare metal film resistors and metal oxide film high resistance resistors, integrated circuit wiring and sensors. These devices are very important in electronic computers, communication instruments, and electronic switches. Due to its excellent performance, resistors made from NiCrSi high-resistance sputtering targets have gradually become a new generation of universal resistors that replace carbon film resistors. Here are two methods for preparing NiCrSi high-resistance sputtering targets.

Adding rare earth metals to improve the target performance

Raw materials: chromium and nickel with an elemental purity greater than 99.5%; silicon with an elemental purity greater than 99.9%; rare earth metals with a mixture purity greater than 98%.

Rare Earth Element
Rare Earth Element
  • Step 1: Smelt Ni, Cr and a small amount of Si into an intermediate NiCrSi alloy. The voltage during the melting of the electric arc furnace is 20V, the current is 500~600A, and the time is 2~5min.
  • Step 2: Place the prepared intermediate NiCrSi alloy was in the bottom of the feeder in a vacuum induction melting furnace. Add the refractory Si material after the intermediate alloy is melted. The vacuum degree during vacuum induction melting is 2 × 10 -2 torr, the power is 35 kW, and the time is 1 h.
  • Step 3: Refining. The power is 20 kW and the time is 30 min.
  • Step 4: Add the rare earth metal in the refining stage. Stir the solution is uniformly by electromagnetic induction and inject it into the investment mold. After the mold is cooled, release the mold to obtain the casting mold.
  • Step 5: Heat treat and machine the target casting. The heat treatment process has a temperature of 800 ° C and a time of 2 h.

Adding titanium to improve the target performance

Raw materials: chromium and nickel with an elemental purity greater than 99.5%; silicon with an elemental purity greater than 99.9%; titanium with an elemental purity greater than 99.5%.

  • Step 1: Use a corundum-graphite-magnesia composite intermediate frequency vacuum induction furnace. Place the prepared materials in a corundum crucible and smelt them under a vacuum of 1×10-2 torr. The melting temperature is 1,500 to 1,550 ° C, the time 1 h, the power of the medium frequency induction furnace is 10~40kW, and the voltage and current of the induction coil are 100~400V and 200~380A respectively.
  • Step 2: Set a casting tube in the mold shell and extend the nozzle to the bottom surface of the mold shell. Then bake the mold shell to reach 650-700 ° C for casting. After that, cool the mold shell slowly to 850-800 ° C and kept the temperature for 1 h. Then cool it to the room temperature.

Target Bonding for NiCrSi Target

To increase the strength of the target, the NiCrSi target requires a copper plate to be soldered on the back side. The shape and size of the copper plate are the same as the target, and the thickness is 1~3mm. The target and the copper plate are welded firmly by indium bonding or elastomeric bonding, and the soldering temperature is 250 to 270 ° C for 4 hours.

Target Bonding
Target Bonding

Please visit https://www.sputtertargets.net/ for more information.

Thinning and Coating Process of Mobile Phone Cover Glass

According to the needs of various terminal applications, glass cover panels require various optical glass processing processes such as cutting, edging, drilling, polishing, thinning, chemical strengthening, printing, laser engraving and coating. Today we will introduce the thinning and coating of mobile phone cover glass, which are the most important parts of the whole manufacturing process.

Cover glass thinning process

The glass mentioned in this article is not the 3mm, 5mm, 8mm or even 10mm glass for civil use, but the cover glass for electronic products such as smartphones and tablet computers. Among the glasses currently on the market, the thinnest is 0.15 mm. There is a special thinning process that reduces the thickness of the glass.

Since Steve Jobs started using Corning Gorilla Glass for his iPhones, there emerges a new component for electronic products—cover glass. At the same time, the pursuit of thinner and lighter in the industry is also urging glass manufacturers to make changes to make thinner cover glass.

iPhone cover glass
iPhone cover glass

Currently, the thinnest glass of gorilla can be made 0.4mm, and the Asahi Glass can make 0.2mm glass. In general, people’s expectations for cover glass are nothing more than two:

1. Reduce the space occupied by the glass.

2. Make the glass cover a certain flexibility.

Mobile phone cover glass thinning process

There are not many processes for glass cover thinning: pre-cleaning—etching and thinning—–secondary cleaning——-grinding (single or double sided)—–post-cleaning—–check the package

Pre-cleaning: Remove the stain on the surface of the glass cover. It is one of the key steps affecting the effect of thinning.

Etching and thinning:  using acid and alkali to etch the glass cover achieve the purpose of thinning. The conditions and parameters (time, potash ratio, temperature, etc.) vary from manufacturer to manufacturer, which is the technical secret of the manufacturer.

Secondary cleaning: Clean the residue of the glass cover.

Grinding: To obtain a bright, flat surface. It is one of the key processes for appearance assurance and thickness tolerance control.

Post-cleaning: Clean the remaining grinding powder.

Check the packaging: The standard for the appearance of the glass is different depending on the requirements of the customer.

Mobile phone cover glass thinning treatment

1, multiple pieces of upright soak

2, waterfall flow processing

3, single piece vertical spray

Cover glass coating process

At present, vacuum magnetron sputtering coating technology is a widely used thin film deposition technology. The continuous development of sputtering technology and the exploration of new functional films have enabled the application of magnetron sputtering coating technology to be extended to many productions and scientific research fields.

magnetron sputtering system

magnetron sputtering coating applications

In the field of microelectronics, as a non-thermal coating technology, magnetron sputtering coating technology is mainly applied to materials that are not suitable for chemical vapor deposition or metal organic chemical vapor deposition. Moreover, using magnetron sputtering can obtain a large-area uniform film.

Magnetron sputtering technology is also used in optical films such as antireflection glass, low emissivity glass and transparent conductive glass. In the production of transparent conductive glass, the ITO conductive glass prepared by sputtering has an average transmittance of 90% or more in the visible light range.

In the modern machining industry, the use of magnetron sputtering technology to produce surface functional films, super hard films and self-lubricating films can effectively improve surface hardness, composite toughness, wear resistance and high temperature resistance and chemical stability, thus improve the service life of coated products.

In addition, magnetron sputtering coating technology also plays an important role in the research of high temperature superconducting thin films, ferroelectric thin films, giant magnetoresistive thin films, thin film luminescent materials, solar cells, and memory alloy thin films.

Magnetron sputtering coating advantages

Magnetron sputtering coating technology has become one of the main technologies of the industrial coating due to its remarkable advantages:

(1) Simple operation and easy control. In the coating process, if the sputtering conditions such as working pressure and electric power are relatively stable, the deposition rate is relatively stable.

(2) The deposition rate is high. When depositing most of the metal, especially the high melting point metal and oxide, such as tungsten, aluminum TiO2 and ZrO2 film, it has a high deposition rate.

(3) Low temperature of the substrate. Compared to two-pole sputtering or thermal evaporation, magnetron sputtering reduces the heating of the substrate, which is quite advantageous for achieving the sputter coating of the fabric.

(4) The sputtered film is strong. The sputtered film has excellent adhesion to the substrate and its mechanical strength is also improved.

(5) The sputtered film is dense and uniform. From the photomicrograph, the surface morphology of the sputtered film is fine and uniform.

(6)The sputtered films all have excellent properties. For example, sputtered metal films generally achieve good optical properties, electrical properties, and certain special properties.

(7) Easy to mass produce. The magnetron source can be expanded as required, so large-area coatings are achievable. In addition, sputtering can work continuously, and the coating process is easy to control automatically, so that the industrial assembly line can be realized.

(8) Environmentally friendly. Conventional wet plating produces waste liquid, waste residue, and exhaust gas, causing serious pollution to the environment. The magnetron sputtering coating method has high production efficiency while does not cause environmental pollution.

Please visit https://www.sputtertargets.net/ for more information.

Year in Review: 2018 Top Posts Collection

Happy New Year in 2019! We are very happy with your company and encouragement that push us to insist on updating every week. On the occasion of the arrival of 2019, let us summarize the Top Posts in 2018 for you.

Metal History

“Metal History” is a popular column we have opened this year, aiming at introducing the discovery of different kinds of metals. Among them, the Top 3 posts in this column are as follows:

How was titanium discovered? | History of Titanium

Titanium is a metal element that is known as “space metal” because of its light weight, high strength and good corrosion resistance. The most common compound of titanium is titanium dioxide, and other compounds include titanium tetrachloride and titanium trichloride. Click the title of the article to know more.

Discovery and development of tungsten | History of Tungsten

The history of tungsten dates back to the 17th century. At that time, miners in the Erzgebirge Mountains of Saxony, Germany, noticed that some of the ore would interfere with the reduction of cassiterite and produce slag. The miners gave the mines some German nicknames: “wolfert” and “wolfrahm”. Click the title of the article to know more.

How was cerium discovered? | History of Cerium

Cerium is the most abundant rare earth elements. It is a silvery gray active metal, whose powder is easily oxidized in the air and soluble in acid. Cerium has been widely used in the automotive industry as a catalyst to reduce emission, and in glass industry as glass polishing materials. Cerium sputtering target is an important material in optical coating. Click the title of the article to know more. Click the title of the article to know more.

Metal Materials Application

Apart from history, we also introduce the multiple applications of these metal materials. Among them, the Top 3 posts in this column are as follows:

Molybdenum Target Mammography Detection

At present, molybdenum target mammography is considered the recommended breast screening examinations for women’s breast cancer, one of the major causes of deaths among women, affects about 12% of women around the world. Click the title of the article to know more.

Application of titanium and titanium alloys in medical field

Titanium is an ideal medical metal material and can be used as an implant for the human body. Titanium alloy has been widely used in the medical field and has become the material of choice for medical products. Click the title of the article to know more.

A short analysis of sputtering targets for semiconductor application

Semiconductors have high requirements for the quality and purity of the sputtering materials, which explains why the price of anelva targets is relatively high. Click the title of the article to know more.

Sputtering Targets

Sputtering Target is the consistent keyword of our website, and thus we have shared many useful information about some specific type of sputtering targets. Our intention is to help you better understand these materials—their properties, applications, developing prospect and so on. And the followings are the posts you really have to read. Among them, the Top 3 posts in this column are as follows:

PVD vs. CVD: What’s the difference?

In recent years, physical vapor deposition (PVD) and chemical vapor deposition (PVD) have wide applications in various industries to increase the hardness of tools and molds or apply beautiful colors to the products. Thus these two methods are considered as the most attractive surface coating technologies. Click the title of the article to know more.

What is the Indium Bonding for Sputtering Target?

The term “indium bonding” in thin film coating industry, simply speaking, refers to bond two (or more) sputtering targets with indium (In), or one (or more) with indium plate together. Click the title of the article to know more.

What is Target Poisoning in Sputtering Deposition?

At some stage in the sputtering deposition, positive ions are continuously amassed on the surface of the sputtering target. Due to the fact that those fantastic ions aren’t neutralized, the negative bias of the target surface gradually decreases, and progressively the normal operation can not be completed. This is the target poisoning phenomenon. Click the title of the article to know more.

Glad you are part of SAM’s 2018. Next year, please continue following us and we promise to give you more valuable information! Also, you can visit our official website https://www.sputtertargets.net/ for more information.

Happy New Year to All

Introduction to Physical Vapor Deposition Technologies

Thin Film Deposition

Thin film deposition technology refers to the preparation of thin films on the surface of materials used in the fields of machinery, electronics, semiconductors, optics, aviation, transportation and etc., in order to impart certain properties (such as heat resistance, wear resistance, corrosion resistance, decoration, etc.) to these materials.

The two most common forms of thin film deposition techniques are physical vapor deposition (PVD) and chemical vapor deposition (PVD).

Physical Vapor Deposition —PVD

PVD is a process that achieves the transformation of the atoms from the source materials to the substrate to deposit a film by physical mechanisms such as thermal evaporation or sputtering.

PVD includes evaporation, sputtering and ion plating.


Evaporation is a common method of thin-film deposition. It is also called vacuum evaporation because the source material is evaporated in a vacuum. The vacuum allows the vapored particles to travel directly to the substrate, where they condense and deposit to form a thin film.

Evaporation (PVD)
Evaporation (PVD)


Sputtering is a physical vapor deposition (PVD) method of thin film deposition. It is a process whereby particles are ejected from a solid target material (sputtering target) due to the bombardment of the target by energetic particles.

Sputtering (PVD)
Sputtering (PVD)

Ion Plating

Ion plating is a physical vapor deposition (PVD) process which uses a concurrent or periodic bombardment of the substrate, and deposits film by atomic-sized energetic particles.

Ion Plating (PVD)
Ion Plating (PVD)

Characteristics of the main physical vapor deposition method

SAM Sputter Target Evaporation Sputtering Ion Plating
Particle energy eV 0.1-1 1-10 0.1-1
Deposition Rate um/min 0.1-70 0.01-50 0.1-50
Adhesion Poor Good Very Good
Density Low High Very High

Among the above three methods, although Ion plating’s film adhesion and density are better, due to technical limitations, the other two methods (evaporation and sputtering) are currently more widely used. In general, sputtering is the best PVD technology.

Stanford Advanced Materials (SAM) is one of the most specialized sputtering targets manufacturers, please visit https://www.sputtertargets.net/ for more information.

Copper Sulfide Sputtering Targets Are The Best Sputtering Materials

Sputtering is a thin film deposition process in the modern technology world of CDs, semiconductors, disk drives and optical devices industries. Sputtering is the process at an atomic level, where the atoms are automatically sputtered out from the sputtering materials and then be deposited on another substrate, such as a solar panel, semiconductor wafer or optical device. It is an effect of the severe bombard of the high energy particles on the target.

In general, sputtering occurs only when kinetic energy is said to be bombarding particles at very high speeds, which is much higher than a normal thermal energy. At the atomic level, this makes thin film deposition more precise and accurate than that by melting the source material using conventional thermal energy.

Copper Sulfide is the best material for Sputtering Targets. It can be molded into the shape of Plates, Discs, Step Targets, Column Targets and Custom-made. Copper Sulfide is a combination of two materials—Copper and Sulphur. The chemical name of the product is CuS, which offers you the Copper Sulfide product with more than 99 percent purity.


CopperCyprus is the original source material for the chemical element Copper. The people of Middle East initially discovered it in 9000 BC. “Cu” is the canonical chemical symbol of copper.


SulfurWhereas Sulfur, otherwise known as sulphur, is first introduced in 2000 BC and discovered by Chinese and Indians. It is a chemical name originated from the Sanskrit word ‘sulvere’, and the Latin ‘sulfurium’. Both names are for sulfur.


Copper Sulfide metal discs and plates are highly adhesive and resistant against oxidation and corrosion. Using Copper Sulfide sputtering targets to deposit thin films will not produce highly reflective and extremely conductive films, but can also extensively increase the efficiency of the source energy.

So to achieve the desired noticeable result in a sputtering deposition, the built-up process used to fabricate the Sputtering Targets should be critical. A Copper Sulfide targeted material will give the best result. However, material like only an element, alloys, mixture of elements, or perhaps a compound can be used for the purposes.

For more information about sputtering targets, please visit http://www.sputtertargets.net/.

What is the Indium Bonding for Sputtering Target?

The term “indium bonding” in thin film coating industry, simply speaking, refers to bond two (or more) sputtering targets with indium (In), or one (or more) with indium plate together.


Indium can be uniquely used in lower temperature solders, is one of the softest materials. Indium is preferred for target bonding because of its excellent thermal conductivity of all available bonds. In addition, indium is the most efficient material at drawing heat away from the sputtering target. Most materials can be indium bonded and there are just a few exceptions.

Apart from indium bonding, indium is also popular for a variety of uses and purposes, such as creating alloys, photoconductors, and thermistors.

Indium bond

Sputtering target can be cracked, warped or damaged due to inadequate cooling, low hardness or other reasons. From this point of view, although target bonding does generate a fee, it can well protect your target from damage. It is especially true for those less-strong target materials and precious metal materials.

Elastomer is an alternative bonding method that touts a higher temperature capability over the indium bond. Elastomer bonds are recommended when you are consistently melting indium bonds. We also recommend elastomer bonding for low melting point target materials, as well as, temperature sensitive compounds and targets that have either low density or are especially fragile.

indium target bonding

Indium bonding is preferred in applications where:

Cryogenic stability is needed

Sealing requires high levels of hermeticity

Maximum thermal transfer is required

Bonding to not-metallic surfaces

Flux cannot be used

Backing plates

OFHC Copper Backing Plate is another well-known backing plate. It is frequently used to bond ceramic targets because of its non-magnetism and low coefficient of thermal expansion. This metal has good electrical and thermal characteristics while also being easy to machine, easy to soften, and readily available at a low cost. Copper backing plates can be re-used, with care, 20 or more times.

Molybdenum plate is usually used to substitute copper plate if copper is not appropriate in the application. For instance, the coefficient of expansion for copper is mismatched with some ceramics. And for high-temperature bonding, copper may also oxidize badly or warp. In these conditions, molybdenum is a more suitable material.

SAM Sputter Target

If you are looking for an indium bonding manufacturer, SAM is undoubtedly your best choice. Stanford Advanced Materials is devoted to machining standard backing plates and working together with the Taiwan Bonding Company for providing bonding services. For questions about target bonding materials, methods and services, please see our listing of frequently asked questions (FAQs).

Related blog: When do you need target bonding?

When do you need target bonding?

This post gives an answer when should require a target bonding service and how to choose different bonding services.

SAM®Sputtering targets are the material that is indispensable during a sputtering process. Sputtering targets are normally comprised of one to three distinct parts, including the backing tube, a bonding layer, and the target material. The figure shown below is an example of rotatory sputtering target. Among them, the former two parts are not unnecessary, depending on the type of materials required for the sputtering process and the manufacturing techniques that are available to produce the target. If the target material is brittle and can be easily broken during the sputtering process, it is necessary to require a target bonding service.

parts of rotatory target
parts of rotatory target


In terms of the target material, sputtering target varies from pure metal to ceramics. Many pure metal targets are stronger, thus some of them can be made into single piece or monolithic targets without the backing tube or a bonding layer. In contrast, ceramic targets usually require the three-layer construction technique because they are not strong enough to support their own weight and the pressure inside the tube.

Ceramic targets are usually bonded to a stainless steel backing tube because of its non-magnetism and low coefficient of thermal expansion. The thermal expansion coefficients of the backing tube material and the target can never be ignored, because a great difference between these two coefficients can lead to large stress concentrations in the target material during the sputtering process that can cause the ceramic materials to crack and break off.

In addition to stainless steel backing, indium bonding is used more frequently due to its low melting point, good thermal conductivity, low chemical reactivity, and good adhesion to most materials. Indium has the best thermal conductivity of all available bonds and is the most efficient at drawing heat away from the target. Most materials can be indium bonded but there are a few exceptions, mainly due to the low melting point of indium. Indium has a melting point of 156.6°C so temperatures in excess of 150°C will cause the bond to melt and fail.

Stanford Advanced Materials is devoted to machining standard backing plate. Please visit https://www.sputtertargets.net/ for more information.

Optical Coating: Anti-wear films (hard coating film)

As a raw material for the deposition of hard coatings by PVD technology, the target will directly affect the physical and mechanical properties of the hard coating films. Therefore, the selection of good sputtering targets for coating preparation is of great practical significance.

Spectacle lenses made of inorganic materials or organic materials can cause scratches on the surface of the lens due to friction with dust or gravel (silicon oxide) during daily use. Compared with glass sheets, organic materials have lower hardness and are more likely to cause scratches. Through the microscope, we can observe that the scratches on the surface of the lens are mainly divided into two types: one is because the scratches generated by the gravel are shallow and small, and the wearer is not easy to detect; the other is the scratch caused by the larger gravel, which is deep and peripherally rough, and will affect people’s vision if it is in the central area. In order to improve the anti-wear of optical lenses, people began to study optical coatings to produce anti-wear films.


Technical Development

First generation anti-wear film technology

Anti-wear films began in the early 1970s when it was thought that glass lenses were not easy to wear because of their high hardness, while organic lenses were easy to wear because they are too soft. Therefore, the quartz material is plated on the surface of the organic lens under vacuum to form a very hard anti-wear film. However, due to the mismatch between the thermal expansion coefficient and the substrate-based material, the film is easy to take off and the film layer is brittle, thus the anti-wear effect is not ideal.

Second generation anti-wear film technology

After the 1980s, researchers theoretically found that the mechanism of wear is not only related to hardness, but also related to the dual characteristics of “hardness/deformation” of the film material, that is, some materials have higher hardness but less deformation, while some materials have lower hardness but greater deformation. The second generation of anti-wear film technology is to apply a high hardness and less brittle material to the surface of the organic lens by the immersion process.

Third generation anti-wear film technology

The third generation of anti-wear film technology was developed after the 1990s, mainly to solve the problem of wear resistance after the organic lens is coated with anti-reflection film. Since the hardness of the organic lens substrate and the hardness of the anti-reflection film layer are very different, the new theory suggests that an anti-wear film layer is required between the two layers, so that the lens are not easy to be scratched. The hardness of the third-generation anti-wear film material is between the hardness of the anti-reflection film and the lens base, and the friction coefficient is low and is not easily cracked.

optical coating

Hard coating film preparation technology

Physical vapor deposition is the mainstream technology of hard coating materials preparation. The main methods are sputtering, such as magnetron sputtering; and cathode arc evaporation, such as multi-arc ion plating.

Sputter Coating

Sputtering uses ions generated by an ion source (generally Ar ions), and accelerates them into a high-speed. The high-energy ion beam in a vacuum electric field bombards the surface of the sputtering target, and kinetic energy exchange between ions and target atoms. When the ion energy is sufficient, atoms on the surface of the sputtering target will leave the target and deposit on the surface of the substrate to form a thin film.

Cathodic arc evaporation

Cathodic arc evaporation is a PVD deposition method that uses arc evaporation electrode material as a deposition source. The low-voltage, high-current electron beam forms an arc on the surface of the material. When the arc moves on the surface of the target, the high current forms a local high temperature, which causes the surface of the metal ion evaporation material on the target surface to form a plasma. After that, a high-speed high-energy ion current is obtained by the electric field, and a film of the coating material is deposited on the surface of the substrate.

As a raw material for the deposition of hard coatings by PVD technology, the target will directly affect the physical and mechanical properties of the hard coating films. Therefore, the selection of good sputtering targets for coating preparation is of great practical significance.

Please visit https://www.sputtertargets.net/ for more information.