Category: pvd coating

4 Categories of Thin Film PVD Materials

Introduction

In the ever-evolving field of material science, Physical Vapor Deposition (PVD) stands as a cornerstone technology, enabling the development of high-performance coatings across a myriad of industries. At the heart of this technology lies a diverse array of materials, each selected for its unique properties to meet specific application demands. From the reflective surfaces of optical devices to the durable exteriors of aerospace components, the choice of PVD materials directly influences the functionality and efficiency of the final product. This article delves into four pivotal categories of PVD materials—sputtering targets, evaporation materials, inorganic chemicals, and specialized PVD materials—exploring their roles, properties, and the customization options that tailor them to their respective applications.

Read more: PVD Thin Film Deposition Materials List

Sputtering Targets

Sputtering targets play a pivotal role in the Physical Vapor Deposition (PVD) process, serving as the source material for thin film coatings. This technique involves bombarding a solid target with high-energy ions, causing atoms to be ejected and deposited onto a substrate, forming a thin film. The choice of target material, such as gold for its unparalleled electrical conductivity or chromium for its exceptional corrosion resistance, is crucial for achieving the desired properties of the final coating.

The customization of sputtering targets is a critical factor in optimizing the PVD process. By tailoring the shape, size, and composition of the target, manufacturers can ensure efficient and uniform deposition, significantly enhancing the performance of the coating. This adaptability allows for a high degree of control over the film’s thickness, composition, and microstructure, meeting the precise requirements of various applications.

Advancements in sputtering technology continue to broaden the range of applications for sputtering targets. From enhancing the durability of aerospace components to improving the efficiency of solar panels, the applications of sputtering targets are expanding into new industries. These advancements not only demonstrate the versatility of sputtering as a deposition method but also underscore the importance of continuous innovation in target material development to meet the evolving needs of technology and industry.

Evaporation Materials

In the realm of Physical Vapor Deposition (PVD), evaporation materials hold a distinct place due to their role in creating thin films through the process of material vaporization and subsequent condensation on a substrate. This method utilizes materials such as silver, known for its excellent reflective properties, making it indispensable for optical coatings. Similarly, copper, celebrated for its high thermal conductivity, is a prime choice for coatings that demand efficient heat management solutions.

The capability to customize these evaporation materials, including the development of specific alloys like Zinc Tin (Zn/Sn), enables engineers to precisely manipulate the thin film’s properties. This level of control is critical for tailoring the film’s optical characteristics, electrical conductivity, or thermal properties to suit specific application needs. By adjusting the composition, form, and purity of the evaporation material, it’s possible to achieve high-performance coatings with optimized characteristics.

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Zinc Tin (Zn/Sn) Evaporation Materials

The impact of selecting the right evaporation material extends far beyond the quality of the thin film itself. It influences the efficiency of the deposition process, the durability of the coating, and ultimately, the performance of the end product. For instance, the choice of silver for reflective coatings in high-end optical applications not only enhances the product’s functionality but also its longevity. Similarly, copper’s use in thermal management coatings can significantly improve electronic devices’ performance and reliability by efficiently dissipating heat.

As PVD technologies advance, the possibilities for customizing evaporation materials expand, opening new avenues for innovation in thin-film applications. Whether it’s developing more efficient solar panels or enhancing the durability of electronic displays, the evolution of evaporation materials continues to drive the advancement of coating technologies and the industries they serve.

Inorganic Chemicals

Inorganic chemicals serve as fundamental components in the Physical Vapor Deposition (PVD) process, especially when the aim is to achieve specific optical or mechanical properties within thin films. Silicon dioxide (SiO2) and zinc sulfide (ZnS) are exemplary materials in this category, leveraged for their distinct capabilities in enhancing or manipulating light reflection and transmission, critical in optical coatings, and infrared applications, respectively.

The use of inorganic chemicals in PVD processes is highly diversified, thanks to the ability to tailor these materials to precise specifications. Silicon dioxide, for instance, is a staple in creating anti-reflective coatings, significantly reducing unwanted reflections in lenses and display screens. On the other hand, zinc sulfide finds its place in night-vision equipment, exploiting its infrared properties to enhance visibility under low light conditions.

Custom formulation of these chemicals is not uncommon in the industry. Manufacturers often require specific chemical compositions and forms, such as powders or pellets, to achieve optimal application results. This customization ensures that the PVD materials precisely match the intended application’s performance criteria, ranging from enhancing durability to improving efficiency or aesthetic qualities.

Case studies across various sectors demonstrate the effectiveness of inorganic chemicals in specialized coatings. For example, the application of silicon dioxide in the telecommunications industry has enabled the production of more efficient fiber optic cables by minimizing light loss. Similarly, the automotive sector benefits from zinc sulfide-based coatings, enhancing the durability and performance of infrared sensors used in driver-assistance systems.

These examples underscore the critical role of inorganic chemicals in advancing PVD technology and their contribution to the development of innovative products and solutions. The ability to customize these materials to meet exacting standards is a testament to the flexibility and adaptability of PVD processes, paving the way for further advancements in materials science and engineering.

Specialized PVD Materials

The category of specialized PVD materials includes advanced compounds such as silicon carbide (SiC) and aluminum nitride (AlN), each selected for its unique set of properties that address specific challenges in harsh environments and high-tech applications. These materials exemplify the innovative edge of PVD technology, offering solutions where traditional materials fall short.

Silicon Carbide (SiC) stands out for its exceptional hardness and thermal conductivity, making it an ideal candidate for protective coatings in environments subjected to extreme wear and high temperatures. Its application spans various industries, from aerospace, where engine components benefit from SiC’s durability and thermal resistance, to electronics, where SiC enhances the longevity and performance of semiconductor devices.

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Silicon Carbide Powder

Aluminum Nitride (AlN), with its remarkable electrical insulation properties combined with high thermal conductivity, is particularly valuable in electronic applications. It’s used to fabricate substrates and insulating layers that can efficiently draw heat away from sensitive electronic components, thus preventing overheating and ensuring reliable operation under demanding conditions.

The role of these specialized materials in advancing PVD applications cannot be overstated. They not only provide enhanced performance and durability but also enable the development of technologies that were previously unattainable. For instance, the use of SiC in protective coatings has led to the creation of cutting tools that can operate at higher speeds and temperatures, significantly increasing productivity and reducing downtime.

Looking forward, the potential for new compounds and innovative applications of specialized PVD materials is vast. Ongoing research and development are expected to unveil materials with even greater capabilities, further expanding the horizons of what can be achieved with PVD coatings. Whether it’s developing ultra-resistant coatings for next-generation spacecraft or creating more efficient thermal management solutions for the latest electronics, specialized PVD materials are at the forefront of technological innovation.

Conclusion

The exploration of the four pivotal categories of PVD materials—sputtering targets, evaporation materials, inorganic chemicals, and specialized PVD materials—reveals the depth and breadth of options available for modern coating technologies. Each category offers unique properties that can be tailored to meet the exacting demands of various applications, from enhancing the optical performance of devices to improving the durability of components exposed to extreme conditions.

This diversity not only underscores the versatility of PVD technology but also highlights the importance of material selection in achieving the desired outcomes. Whether it’s choosing the right sputtering target for electrical conductivity or selecting a specialized material for thermal insulation, the success of PVD processes hinges on a deep understanding of material properties and their interactions with specific applications.

Looking ahead, the continued innovation and development of new PVD materials promise to further expand the capabilities of this technology. As industries push for higher performance standards and environmental sustainability, the role of advanced PVD materials will undoubtedly grow, driving new applications and improvements across a wide range of sectors.

For those navigating the complexities of PVD processes, the guidance o

experts and suppliers like Stanford Advanced Materials (SAM) can prove invaluable. SAM’s expertise in providing high-quality PVD materials, coupled with a deep understanding of industry-specific requirements, ensures that clients can make informed decisions, optimizing their processes and products for the challenges of tomorrow.

In conclusion, the role of PVD materials in advancing technological and industrial innovations cannot be overstated. As we continue to explore the potential of these materials, their impact on shaping the future of manufacturing, electronics, aerospace, and beyond is poised to be profound, marking a new era of material science and engineering excellence.

PVD vs. CVD Temperature Considerations

Introduction

Thin-film deposition techniques are pivotal in shaping the properties of materials across various industries. Among these techniques, Physical Vapor Deposition (PVD) and Chemical Vapor Deposition (CVD) stand out, offering unique approaches to coating materials onto substrates. In this exploration, we delve into the critical factor of temperature, comparing the temperature dynamics of PVD and CVD and unraveling their implications.

Temperature Dynamics in PVD

Physical Vapor Deposition encompasses evaporation and sputtering processes, both of which operate at relatively low temperatures. This characteristic holds significant advantages, particularly for preserving the integrity of temperature-sensitive materials. These lower temperatures make PVD suitable for a broad range of applications, from electronics to automotive industries.

The evaporation process involves transitioning materials from a solid to a vapor state, while sputtering entails ejecting particles from a target material. This physical approach not only ensures the preservation of material properties but also allows for the coating of temperature-sensitive substrates.

Temperature Dynamics in CVD

Contrastingly, Chemical Vapor Deposition relies on chemical reactions to deposit thin films onto substrates. This method operates at significantly higher temperatures than PVD. The elevated temperatures are essential for the chemical reactions to take place, presenting challenges, especially when coating materials onto tools made of high-speed steel.

Chemical Vapor Deposition offers precise control over the composition and structure of the deposited films, making it a preferred choice in semiconductor manufacturing, aerospace, and the production of advanced materials. However, the high temperatures involved can impact the hardness of tools, necessitating additional heat treatments, such as vacuum heat treatment, to restore their properties.

Comparative Analysis

The temperature differences between PVD and CVD play a crucial role in determining their applicability. PVD’s relatively low operating temperatures provide versatility, allowing for the coating of temperature-sensitive materials. In contrast, CVD, with its higher temperatures, demands careful consideration, particularly when dealing with tools made of high-speed steel.

Material compatibility is another aspect influenced by temperature differences. PVD proves to be suitable for a broad range of materials, including those sensitive to high temperatures. On the other hand, CVD may require additional post-coating treatments to restore the hardness of tools, ensuring optimal performance.

A practical example highlighting the necessity of vacuum heat treatment in CVD for tool coatings emphasizes the intricate relationship between temperature dynamics and the performance of coated materials. Tools subjected to CVD processes may experience a loss of hardness, underscoring the importance of understanding and managing temperature variations in thin-film deposition.

Link to the Comprehensive Guide: Exploring the Temperature Dynamics in Thin-Film Deposition: A Comparative Analysis of PVD and CVD

Conclusion

In conclusion, the temperature dynamics in thin-film deposition techniques are pivotal factors influencing the choice between PVD and CVD. Understanding the operating temperatures, material compatibility, and the impact on specific applications is crucial for making informed decisions. As industries continue to push the boundaries of material science, the balance between temperature considerations and desired outcomes remains at the forefront of thin-film deposition advancements.

Unlocking the Benefits of Zirconium Targets for High-Quality Thin Film Coatings

Introduction

Zirconium targets are a critical component used in many different industries to create high-quality thin films through physical vapor deposition (PVD) and sputtering processes. In this article, we will explore the various benefits of zirconium targets that make them an ideal choice for researchers and manufacturers.

Consistent and Uniform Coatings

One of the primary advantages of zirconium targets is their ability to produce consistent and uniform coatings. With their excellent thermal conductivity, zirconium targets can maintain a stable temperature during the sputtering process, which helps to ensure that the resulting film is free from defects and of high quality.

Durable and Resistant to Wear

Zirconium targets are highly durable, making them an ideal choice for use in harsh or demanding operating conditions. Whether they are being used for coating medical devices, automotive parts, or aerospace components, zirconium targets are able to withstand the stresses of repeated use and exposure to harsh environments.

Versatility in Creating Complex Multilayer Coatings

Zirconium targets are also highly versatile. Not only can they be used to create high-quality zirconium coatings, but they can also be used to deposit other materials such as aluminum, titanium, and silver. This makes zirconium targets a valuable tool for researchers and manufacturers who need to create complex multilayer coatings with precise control over the thickness and composition of each layer.

Ideal for Applications Where Purity Is Critical

Zirconium targets are an excellent choice in applications where purity is critical. Because zirconium is a highly refractory metal, it has a low affinity for impurities and can help to maintain the purity of the coating material. This is particularly important in applications such as semiconductor manufacturing, where even small amounts of impurities can have a significant impact on the performance and reliability of the final product.

Cost-Effective Solution

Finally, zirconium targets offer an attractive cost-effective option for researchers and manufacturers. Compared to other types of sputtering targets, zirconium targets are relatively low in cost, making them an accessible choice for many different applications. Additionally, their long lifespan and durability mean that they can be used for extended periods without needing to be replaced, further reducing the overall cost of operation.

Conclusion

In summary, zirconium targets are highly versatile, durable, and cost-effective, making them a valuable tool in many different industries. With their ability to produce consistent and uniform coatings, withstand harsh environments, create complex multilayer coatings, and maintain the purity, zirconium targets offer an ideal solution for meeting coating needs in a wide range of applications.

Read more on sputtertargets.net.

Gold Sputtering Target for Semiconductor Coating

Gold sputtering targets can be deposited on a semiconductor chip such as GaAs, GaP, GaN, or the like by sputtering, and can form an ohmic contact film, an electrode, and a wiring film, thereby improving the conductivity and working efficiency of the semiconductor.

The Physical Vapor Deposition Process for Semiconductor Coatings

Physical vapor deposition (PVD) is a widely used method for depositing thin films onto semiconductor substrates such as silicon wafers. The PVD process involves the transfer of material from a sputtering target or an evaporation source to a substrate. This process is carried out in a vacuum environment to prevent contamination and ensure uniform deposition of the material.

PVD is generally divided into two methods based on the principles involved in the deposition: sputtering and evaporation.

Sputtering: How It Works and Its Variations

Sputtering is like throwing stones into a pool of mud, which will splatter a lot of mud and cover the surface of other objects. Sputtering relies on argon plasma to impact the gold sputter target at high speed, thus sputtering the material near the surface of the target and dropping it onto the wafer to form a gold film.

Sputtering is also divided into direct current (DC) sputtering and radio frequency (RF) sputtering depending on the energy source of the plasma excitation. Basically, both methods can be coated with a metal film. The latter is more directed to non-metallic films such as piezoelectric or magnetic materials. The film formed by sputtering has the characteristics of insulation and a high melting point.

Evaporation: Types and Differences from Sputtering

The evaporation method differs from the heating method and is classified into two types: a thermal coater and an E-gun evaporator. The former is to directly put the pellets prepared for melt evaporation on the heating tungsten wire. Once heated, it will adhere to the heated tungsten wire due to the surface tension of the liquid and then be steamed to the periphery (including the wafer). Due to the limited heat resistance of the heated tungsten wire and the limited space for the molten metal, it is only used for low melting point materials, and the film thickness is limited.

The electron gun-type vaporizer uses an electron beam for heating, and the molten and evaporated metal particles are all placed in a graphite or tungsten crucible. When the metal vapor pressure exceeds the critical limit, it begins to slowly evaporate for four weeks (including wafers). The electron gun-type vaporizer can evaporate a metal with a higher melting point and the thickness is not limited.

Advantages and Applications of Gold Sputtering Targets in the Semiconductor Industry

Gold sputtering targets have several advantages that make them a highly desirable material in the semiconductor industry. One of the most significant advantages of gold sputtering targets is their high electrical conductivity, making them ideal for use in forming electrodes, ohmic contacts, and wiring films in semiconductors. Furthermore, gold sputtering targets are known for their excellent adhesion properties, which ensure a strong bond to the substrate surface.

Conclusion

In conclusion, gold sputtering targets are important materials in semiconductor coating applications, and both sputtering and evaporation are commonly used methods for PVD. The choice of method depends on several factors such as deposition rate, film quality, and adherence of the deposited film required for the application. For more information, please visit https://www.sputtertargets.net/.

Differences Between CVD and PVD Processes and Technologies

The most popular surface treatment technologies, chemical vapor deposition (CVD) and physical vapor deposition (PVD), have been used extensively for nearly 50 years to harden the surfaces of tools and molds. The context that follows compares the technologies and processes of CVD and PVD using the illustration of cutting tools.

Rationale

In the process known as chemical vapor deposition (CVD), a vapor containing a gaseous reactant or a liquid reactant that makes up a thin film element as well as other gases necessary for the reaction are introduced into a reaction chamber in order to chemically react on the surface of the substrate to form a thin film.

Physical vapor deposition (PVD) uses low-voltage, high-current arc discharge technology under vacuum conditions to evaporate the target and ionize the vaporized material and the gas, and finally make the evaporated material and its reaction deposited on the workpiece.

Image Credit: Stanford Advanced Materials

Process and Equipment

1. Temperature

The fundamental distinction between CVD and PVD is temperature. The tools must undergo a vacuum heat treatment after coating since the process temperature of the CVD method is higher than the high-speed steel’s tempering temperature. This will restore the tools’ hardness.

2. Compared to PVD, the CVD method requires less cleaning of the tool entering the reactor.

3. The PVD coating (approximately 2.5 m) is thinner than the CVD coating (about 7.5 m) on the tool’s surface.

4. The CVD coating’s surface is marginally rougher than the substrate’s surface. On the other hand, the PVD coating has a good metallic sheen without grinding and effectively reflects the tool’s surface.

5. The crafting process

CVD has good coating performance and takes place in a gaseous atmosphere with low vacuum. Hence, every surface of the cutters encased in the reactor, including deep holes and inner walls, can be entirely coated, with the exception of the support points.

In contrast, all PVD technologies have poor coating performance both on the back and sides of the tool due to low air pressure. To prevent the production of shadows, the PVD reactor must minimize its loading density, and loading and fixing are challenging. In a PVD reactor, the tool typically revolves constantly, though occasionally it must also reciprocate.

6. Cost

Although the PVD production cycle is one-tenth that of CVD, the initial equipment expenditure is three to four times that of CVD. Whereas PVD is severely constrained, a wide range of workpieces can be treated within a CVD operating cycle. In other words, PVD can cost more than CVD in some cases.

7. Safety

As a form of “green engineering,” PVD creates less pollution when operating. Contrarily, the reactive gas and reaction tail gas of CVD may have some corrosiveness, flammability, and toxicity, and the reaction tail gas may contain powdered and fragmented chemicals, thus particular precautions for the equipment, environment, and operators must be taken.

Stanford Advanced Materials supplies high-quality and consistent products to meet our customers’ R&D and production needs. You can visit our website for more information.

The Role of Sputtering Targets in Vacuum Sputtering

Introduction to Vacuum Sputtering

Vacuum sputtering is a thin-film technology to deposit thin films and coatings by creating a sub-atmospheric pressure environment and an atomic or molecular condensable vapor source. The basic principle is to make argon (Ar) ions hit the surface of the sputtering target through glow discharge in a vacuum, so that the target atoms overflow and deposit on the substrate to form a thin film.

Most general metal materials use DC sputtering, while non-conductive ceramic materials use RF sputtering. The new sputtering coating equipment uses powerful magnets to accelerate the ionization of argon gas around the target material in a spiral shape, thereby increasing the probability of collision between the target material and argon ions, thereby increasing the sputtering rate.

Characteristics of Sputtering Coating Process

(1) It has a wide range of applications, and can make metal, alloy or insulator materials into thin films.

(2) Under proper setting conditions, multi-component targets can be made into thin films with the same composition.

(3) A mixture or compound of the target substance and gas molecules can be produced by adding oxygen or another reactive gas to the discharge atmosphere.

(4) The target input current and sputtering time are controllable, which is conducive to obtaining high-precision film thickness.

(5) Sputtering coating is more conducive to producing large-area uniform films than other processes.

(6) The sputtered particles are not affected by gravity, and the positions of the target and the substrate can be freely arranged.

(7) The bonding strength between the substrate and the film is more than 10 times that of the general evaporated film, and because the sputtering particles have high energy, the surface of the film is continuously diffused to obtain a hard and dense film. At the same time, high energy allows the substrate to obtain a crystalline film at a lower temperature.

(8) The nucleation density is high at the initial stage of film formation, and an extremely thin continuous film of 10 nm or less can be produced.

(9) The target has a long service life and can be continuously produced for a long time.

(10) The target can be made into various shapes, and with the special design of the machine, it can be controlled better and has the highest efficiency.

How Target Purity Affects Thin Film Quality

Many factors can affect the quality of a thin film, of which the purity of the sputtering target has the greatest impact. If the target material is not pure enough, the impurity particles in the target material will adhere to the surface of the substrate during the sputtering process, causing the film layer in some positions to be weak and peel off. Simply put, the higher the purity of the target material, the better the performance of the film.

For targets with poor thermal conductivity, such as silicon aluminum sputtering targets, the heat transfer is often hindered by impurities in the target. There is a difference between the cooling water temperature used in production and the actual water temperature of the coating line, which leads to cracking of the target during use. Generally speaking, slight cracks will not have a great impact on coating production. However, when the target has obvious cracks, the charge is easily concentrated on the edge of the crack, resulting in abnormal discharge on the surface of the target. Discharging will lead to slag falling, abnormal film formation, and increased product scrapping. Therefore, in the process of target preparation and purity control, it is also necessary to control the preparation process conditions.

Stanford Advanced Materials (SAM) is a global sputtering targets manufacturer which supplies high-quality and consistent products to meet our customers’ R&D and production needs. Please visit https://www.sputtertargets.net/ for more information.

 

3 Minutes to Know PVD Gold Sputtering

Gold is a popular precious metal that has been used for centuries as currency, hedging and jewelry for its noble and beautiful gold color.

PVD Gold Sputtering

Gold sputtering coating is a thin film deposition process in which gold or gold alloy is bombarded with high-energy ions in a vacuum chamber, causing gold atoms or molecules to be “sputtered” into the vapor and condensed on the substrate to be coated. Sputtering is one method of the PVD (Physical Vapor Deposition) process, the other two of which are thermal evaporation deposition and electron beam vapor deposition, and gold is also applied in these two methods. In thermal evaporation deposition, gold evaporates in a low-pressure environment with resistive heating elements; and in electron beam vapor deposition, gold is heated by an electron beam, and then condensed on the substrate to be coated.

Gold Plating

Apart from PVD coating, there are other ways for gold coatings such as gold plating and gold filling. Gold plating is a method that deposits a thin layer of gold on the surface of another metal by chemical or electrochemical plating. The advantages of gold plating are inexpensive and easy. However, the coating it produces is relatively soft and less durable, and what’s worse, its chemical process would cause pollution that is far away from environmentally friendly.

Gold Filling

Gold filling is the mechanical bonding of gold to metal under high temperatures and pressure. It produces a thicker coating than PVD gold sputtering and gold plating, and thus it is usually more expensive.

Advantages of PVD gold sputtering

The constant contact of skin or clothing may abrade the coatings, especially in the watch and jewelry industry. Thus, PVD gold sputtering is preferred in these two industries because the coatings it produces are harder and more durable than that of electrolytic gold plating or gold filling.

Compared to other types of gold coatings, the main advantages of PVD gold sputtering coating are their durability, retention of gloss, corrosion resistance, and abrasion resistance in contact with the skin, thus extending the life of the jewelry. PVD gold sputtering not only provides the exact color and brightness which evokes the general feeling of love and attraction with jewelry, but also has the advantage of being more environmentally friendly and durable than gold plating or gold filling for producing a gold coating.

Stanford Advanced Materials(SAM) is a global sputtering targets manufacturer which supplies high-quality and consistent products to meet our customers’ R&D and production needs.

Selection of Common Coating Types of PVD Coating

Physical Vapor Deposition (PVD) is a thin film preparation technique that physically vaporizes the surface of a material source (solid or liquid) into gaseous atoms, molecules, or partially ionized into ions under vacuum conditions. [1]

Achieving a cost-effective application of the coating depends on a number of factors, and for each particular processing application, there is typically only one or several possible coating options. The choice of coating and its characteristics correctly determines the difference between a significant increase in processability and little improvement. Therefore, it is necessary to select a suitable coating according to detailed parameters such as the processing speed, the cooling method, the material to be processed, and the processing method. The following is our recommended coating selection:

TiN

TiN is a versatile coating that increases tool hardness and has a higher oxidation temperature.

Uses: high-speed steel cutting tools, slow processing tools (such as low-speed turning tools), wear parts, injection molds.

TiCN

The TiCN coating is based on the addition of carbon to the TiN to increase the hardness and low coefficient of friction of the coating.

Uses: high-speed steel tools, stamping dies, forming dies

TiAlN, AlTiN

The alumina coating formed by the TiAlN/AlTiN coating during processing can effectively improve the high-temperature processing life of the processing tool. The high-temperature oxidation resistance of the AlTiN coating is about 100 degrees higher than that of TiAlN.

Uses: Carbide tools (TiAlN is recommended when the hardness of the processed material is lower than HRC45 and AlTiN is recommended when the hardness of the processed material is higher than HRC45), thin-walled stamping die (TiAlN), die-casting die (AlTiN)

CrN

CrN coating has good adhesion, corrosion resistance, and wear-resistance.

Uses: processing aluminum alloy, red copper cutter, injection mold, parts (especially with lubricating oil soaking)

CBC(DLC)

The PLATIT CBC coating is composed of a TIN+TICN+DLC structure. It has the advantages of low friction coefficient, wear-resistance, and low stress of the film layer.

Uses: Lubricating coatings, forming dies, aluminum alloys, and other bonding materials stamping dies.

Apart from features and uses, different coating materials also show different colors. If you require the specific color of your coating, you can refer to the sheet below to choose your desirable coating materials.

PVD Coating Colors

Stanford Advanced Materials(SAM) supplies high-quality and consistent products to meet our customers’ R&D and production needs. All the types we talked about above can be found in SAM. Please visit https://www.sputtertargets.net/ for more information.

Reference:

[1] What is Physical Vapor Deposition (PVD)?

PVD Coating: Give Your Watch a Durable Coat

For most people who could not afford a pure gold watch, a gold coating may be a good choice for them. However, since it is a thin film coating, it is inevitable that the gold color would fade out. So the primary consideration in choosing the coating material/method is durability. If you want to give your watch a durable coat, you really should think about PVD coating.

What is PVD coating?

PVD coating, or Physical Vapor Deposition, refers to a variety of vacuum deposition techniques where solid metal is vaporized to produce thin films and coating. The main methods of physical vapor deposition include vacuum evaporation, sputtering deposition, arc plasma plating, ion plating, etc. PVD film has fast deposition speed as well as strong adhesion, good diffraction, and a wide application range.

Maybe you will find it not easy to understand it since PVD is a physical terminology. But actually, as a watch lover, you should just know that PVD coating can provide a metal coat to your watch, making it more beautiful and durable.

Why should you choose PVD coating?

PVD coating has high hardness, high wear resistance, low friction coefficient, good corrosion resistance, and chemical stability. So PVD coating would definitely have a longer lifetime than other traditional coatings. Apart from durability, PVD coating provides multiple kinds of metallic colors, such as gold(TiN), rose gold(TiAlN), silver(Cr2N), brass(ZrN), light grey(TiC), and so on. You will always find the one you like.

PVD Coating Colors

More tips

If you are going to give your watch a PVD coating after reading this blog, I’d like to help you save time in choosing the coating materials. Please consider Stanford Advanced Materials (SAM), which is a global supplier of various technical-grade coating materials as well as high-purity chemicals (up to 99.99999%). All of the coating materials we talked about above can be found on SAM’s website. We ensure that you can get your watch the most durable coat here.

What is Reactive Sputtering Coating Technology?

At present, reactive sputtering deposition is a well-established sputter coating technology and is widely used for industrial coating deposition to produce thin layers for high-added value products, such as flat panel displays, solar cells, optical components, and decorative finishes.

Definition

In the process of reactive sputtering, a target material is sputtered in the presence of a gas or a mixture of gasses that will react with the target material to prepare a compound film of a predetermined chemical ratio. Reactive sputtering is most often practiced using one or more magnetron sputtering cathodes. Therefore, it is also called reactive magnetron sputtering.

Sputtering Target

Sputtering targets can be divided into metal targets, alloy targets, ceramic targets, etc. Metal sputtering targets can be used to produce compound materials. For example, a titanium sputtering target can be used to produce coatings such as TiO2, TiN, and Ti-O-N. Apart from it, titanium targets can also be used to produce any of the aforementioned different compositions as well as boride and carbide films. Compared with the compound target, the metal target has the advantage of longer service life.

Reactive gases

In most cases, Argon is the main gas used in reactive sputtering as well as other sputter coating methods. It has to be mentioned that the amount of a reactive gas introduced into a process chamber should be strictly controlled in order to either achieve a certain amount of doping or to produce a fully reacted compound. Here is a list of other gasses used in reactive sputtering).

Gasses Uses
Oxygen (O2) deposition of oxide films (e.g. Al2O3, SiO2, TiO2, HfO2, ZrO2, Nb2O5, AZO, ITO)
Nitrogen (N2) deposition of nitride films (e.g. TiN, ZrN, CrN, AlN, Si3N4, AlCrN, TiAlN)
Carbon dioxide (CO2) deposition of oxide coatings
Acetylene (C2H2) deposition of metal-DLC, hydrogenated carbide, carbo-nitride films
Methane (CH4) similar applications as for C2H2

Several reactive gasses can be mixed in order to deposit a multi-component functional thin film. Additional reactive gas is sometimes used to enhance a certain deposition process (e.g. addition of N2 in the SiO2 reactive sputtering process).

Application

Coatings and films produced by Reactive Magnetron Sputtering can be used in a large variety of products such as OLED devices, optical antireflective coatings, and decorative coatings.

 Please visit https://www.sputtertargets.net/ for information.