Titanium nitride, a chemical formula of TiN, is an extremely hard ceramic material. Titanium nitride sputtering is commonly used as a coating on titanium alloys, steels, carbides and aluminum components to improve the surface properties of the substrate.
As a thin coating, titanium nitride (TiN) sputtering targets can be used to harden and protect cutting and sliding surfaces, also for decorative purposes (due to its golden appearance), and as a non-toxic medical implant Implanted into the human body. In most applications, the thickness of the TiN coating is less than 5 microns (0.00020 inches).
|Material Type||Titanium Nitride|
|Color/Appearance||Yellow-Brown, Crystalline Solid|
|Melting Point (°C)||2,930|
|Theoretical Density (g/cc)||5.4|
|Max Power Density
|Type of Bond||Indium, Elastomer|
|Comments||Sputtering preferred. Decomposes with thermal evaporation.|
The titanium sputtering target itself has excellent properties such as high corrosion resistance, high mechanical properties, high thermal properties, etc., and is therefore used in many industrial and medical applications. Titanium nitride also has its unique advantages such as wear resistant coatings, tools for cutting, diffusion barriers and integrated circuits. Titanium nitride also has outstanding physical properties such as high hardness, inert, high corrosion resistance, low electrical resistivity, excellent thermal stability. These titanium and titanium nitride coating materials have the combination of toughness, inertness, adhesion and hardness, owing to its excellent Thus, titanium and titanium nitride coatings have various advantages over other coating materials, including microelectronics, photodetectors, cutting tools, and medical instruments. Therefore, there has been a particular interest in these Ti and TiN coatings over the years.
When we look at sputtering targets, we can say that titanium nitride is one of the important compounds prepared by sputter deposition, and these nitride films are used in a wide range of applications. The titanium nitride deposition is prepared by using nitrogen as a reaction gas and argon as a sputtering gas, and the composition of the film can be controlled by using different sputtering gas ratios (Ar / N2 ).