Boron nitride crucible is used at a temperature of approximately 1800 degrees under vacuum and at a temperature of approximately 2100 degrees under atmospheric protection, making it ideal for ultra-high temperature forging.
BN crucible is best used in the nitrogen or argon atmosphere and has the longest life in that environment. The thermal resistance of boron nitride crucible is good. Even if the temperature suddenly becomes cold when it is used at 1500 degrees, it will not crack; after holding it for 20 minutes in a 1000 degree furnace, take it out and blown and quenched it continuously for hundreds of time, it won’t crack, either.
Precautions for use
1 When boron nitride is used in air, the temperature should not exceed 1000 degrees; if the temperature exceeds 1000 degrees, the contact surface of boron nitride and oxygen will oxidize and peel off.
2 Boron nitride is easy to absorb moisture, so BN crucible can not be stored in wet areas, can not be washed, but can be directly wiped with sandpaper or scrubbed with alcohol.
The high-lead glass glaze melts in the air at 800-950 °C, but it does not react under the protection of nitrogen or inert gas. 3. Boron phosphate erodes boron nitride in 1400 ° nitrogen, and reacts with hot concentrated or molten alkali and hot chlorine.
The indium tin oxide (ITO) transparent conductive film belongs to an N-type oxygen-deficient semiconductor material. It has low absorption of visible light and has high visible light transmittance, excellent infrared reflection performance and microwave attenuation performance in the mid-far infrared range. ITO transparent conductive film has become an important optical component in the field of optoelectronic devices due to its excellent photoelectric performance.
ITO materials have long been used as transparent conductive films in the form of single-layer films, but their average transmittance in the visible portion is very low, generally less than 90%, and the reflectance is high, affecting its display and electromagnetic shielding applications. If the transmittance in the visible light region is improved, the application of the ITO transparent conductive film will be more extensive.
The ITO film is usually made of the indium tin oxide sputtering target and the indium tin oxide evaporation material. The use of the ITO film as one of the antireflection film systems can greatly increase the transmittance of the transparent conductive film in the visible light portion, and solves the problem that the transparent conductive film is generally low in visible light transmittance. A multilayer anti-reflection film containing TTO material was prepared by a low-pressure reactive ion plating method, and a transparent conductive film having an average visible light transmittance of 95.83%, a maximum transmittance of 97.26%, and a sheet resistance of 13.2 to 24.6 Ω was obtained. The anti-reflection film largely alleviates the contradiction between the conductivity and the transparency of the transparent conductive film, and the ITO transparent conductive film has more useful practical value and application prospect in the field of application.
Sputtering is a high-speed process where superfast ions hit a sputtering target and dislodge minuscule particles that in turn coat a thin film on substrates like architectural glass, LED televisions and computer displays.
Rotatable sputtering target, or rotatory target, is a commonly used target shape in magnetron sputtering. It is generally cylindrical, with a stationary magnet inside, and a slow magnetic field, which allows the sputtering rate to be uniform and the target utilization rate to be high. Rotating targets are commonly used for coating solar cells, architectural glass, automotive glass, semiconductors, and flat-panel TVs.
The main advantage of the rotatable target is the high utilization of the target, which means that the rotating target can solve the problem of low utilization of the planar target.
For a planar sputtering target, the target utilization of the normal cathode can reach 25%, and the special design of the magnet bypass with the target back can increase the target utilization to about 40%. Despite this, the utilization of planar targets is still not high. However, the utilization of cylindrical rotating targets is typically in the range of 75% to 90%, much higher than planar targets. However, when the rotating target is used for large-area coating, the uniformity of the surface of the film layer is poor and it is difficult to meet the requirements, which is the biggest disadvantage of the rotating target.