Copper Sulfide Sputtering Targets Are The Best Sputtering Materials

Sputtering is a thin film deposition process in the modern technology world of CDs, semiconductors, disk drives and optical devices industries. Sputtering is the process at an atomic level, where the atoms are automatically sputtered out from the sputtering materials and then be deposited on another substrate, such as a solar panel, semiconductor wafer or optical device. It is an effect of the severe bombard of the high energy particles on the target.

In general, sputtering occurs only when kinetic energy is said to be bombarding particles at very high speeds, which is much higher than a normal thermal energy. At the atomic level, this makes thin film deposition more precise and accurate than that by melting the source material using conventional thermal energy.

Copper Sulfide is the best material for Sputtering Targets. It can be molded into the shape of Plates, Discs, Step Targets, Column Targets and Custom-made. Copper Sulfide is a combination of two materials—Copper and Sulphur. The chemical name of the product is CuS, which offers you the Copper Sulfide product with more than 99 percent purity.

 

CopperCyprus is the original source material for the chemical element Copper. The people of Middle East initially discovered it in 9000 BC. “Cu” is the canonical chemical symbol of copper.

 

SulfurWhereas Sulfur, otherwise known as sulphur, is first introduced in 2000 BC and discovered by Chinese and Indians. It is a chemical name originated from the Sanskrit word ‘sulvere’, and the Latin ‘sulfurium’. Both names are for sulfur.

 

Copper Sulfide metal discs and plates are highly adhesive and resistant against oxidation and corrosion. Using Copper Sulfide sputtering targets to deposit thin films will not produce highly reflective and extremely conductive films, but can also extensively increase the efficiency of the source energy.

So to achieve the desired noticeable result in a sputtering deposition, the built-up process used to fabricate the Sputtering Targets should be critical. A Copper Sulfide targeted material will give the best result. However, material like only an element, alloys, mixture of elements, or perhaps a compound can be used for the purposes.

For more information about sputtering targets, please visit http://www.sputtertargets.net/.

Advantages and Disadvantages of Pulsed laser deposition (PLD)

Pulsed laser deposition is one of the methods of thin film preparation, and several others include chemical vapor deposition, material sputtering, and etc. Pulsed Laser Deposition (PLD), also known as Pulsed Laser Ablation (PLA), uses a laser to bombard the surface of the target, raising its surface temperature and further producing high temperature and high pressure plasma ( T>104K), depositing on different substrates to form a film.

Advantages

1 It is easy to obtain multi- component film that is of the desired stoichiometric ratio by PLD.

2 It has high deposition rate, short test period and low substrate temperature requirements. Films prepared by PLD are uniform.

3 The process is simple and flexible with great development potential and great compatibility.

4 Process parameters can be arbitrarily adjusted, and there is no limit to the type of PLD targets. Multi-target components are flexible, and it is easy to prepare multilayer films and heterojunctions.

5 It is easy to clean and can prepare a variety of thin film materials.

6 PLD uses UV pulsed laser of high photon capability and high energy density as the energy source for plasma generation, so it is non-polluting and easy to control.

 Pulsed laser deposition

Disadvantages

1 For quite a number of materials, there are molten small particles or target fragments in the deposited film, which are sputtered during the laser-induced explosion. The presence of these particles greatly reduces the quality of the film.

2 The feasibility of laser method for large area deposition has not been proved yet.

3 Average deposition rate of PLD is slow.

4 In view of the cost and deposition scale of laser film preparation equipment, it seems that PLD is only suitable for the development of high-tech fields such as microelectronics, sensor technology, optical technology and new material films.

 

Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials. Please visit our website https://www.sputtertargets.net for more information.